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Disco Corporation
TSE-6146
Company Overview
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Further, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.
Name
Disco Corporation
CEO
Mr. Kazuma Sekiya
Website
www.disco.co.jp
Sector
Semiconductors and Semiconductor Equipment
Year Founded
1937
Profile
Market Cap
¥3,754.86B
EV
¥3,536.79B
Shares Out
108.37M
Revenue
¥336.39B
Employees
4,886
Margins
Gross
68.72%
EBITDA
45.08%
Operating
40.98%
Pre-Tax
38.61%
Net
28.31%
FCF
26.46%
Returns (5Yr Avg)
ROA
15.46%
ROTA
20.23%
ROE
20.21%
ROCE
27.57%
ROIC
27.24%
Valuation (TTM)
P/E
—
P/B
—
EV/Sales
—
EV/EBITDA
—
P/FCF
—
EV/Gross Profit
—
Valuation (NTM)
Price Target
¥56,780
P/E
—
PEG
—
EV/Sales
—
EV/EBITDA
—
P/FCF
—
Financial Health
Cash
¥218.33B
Net Debt
-¥218.33B
Debt/Equity
—
EBIT/Interest
—
Growth (CAGR)
Rev 3Yr
19.83%
Rev 5Yr
19.18%
Rev 10Yr
11.97%
Dil EPS 3Yr
30.06%
Dil EPS 5Yr
29.3%
Dil EPS 10Yr
21.83%
Rev Fwd 2Yr
23.23%
EBITDA Fwd 2Yr
32.54%
EPS Fwd 2Yr
37.77%
EPS LT Growth Est
25.04%
Dividends
Yield
—
Payout
34.93%
DPS
¥307
DPS Growth 3Yr
10.8%
DPS Growth 5Yr
23.39%
DPS Growth 10Yr
26.18%
DPS Growth Fwd 2Yr
51.34%